Video ArchiveChip King – Engineer: Customer Support
Chip describes how the CEQM57 with Intel® Core™ i5 and i7 processors is a great choice for imaging applications requiring high performance and low power consumption.
Lorraine Orcino – Sr. Product Line Manager, COM Express
The full suite of extended temperature, rugged COM Express modules from RadiSys allows you to select the ideal module for your design based on performance, power and temperature requirements.
Based on the new Intel® Mobile Platform, this new module will give your applications the Performance BOOST they've been waiting for!
Rob Dixon , Staff Reliability Engineer
Hear how the RadiSys execution of HALT/HASS testing is both a discovery and exploratory process to ensure long-term reliability and functionality for products deployed in extreme environments.
Learn how collaborating with the COM Experts at RadiSys will help you make the right decisions for your next COM design.
Updated February, 2010! This handy guide makes it easy to choose the perfect module for your next design project.
The RadiSys Alliance Partner Program (RAPP) provides customers with a rich ecosystem that provide choice, flexibility and time–to–market advantage. The RadiSys Alliance Partner Program (RAPP) provides OEM customers with the broadest portfolio of standards–based building blocks in the industry that deliver choice and flexibility while significantly reducing development risk, time–to–market and cost.
Learn more about Com Express and request our booklet COM Express for Dummies, compliments of Radisys and Intel.
©2010 RadiSys Corporation