Partner with a leader and gain access to the latest COTS-based ATCA and COM Express technologies.

RadiSys brings leading edge technology to today’s standard form factors. Using years of expertise in platform architecture and system development, RadiSys drives technology solutions in critical functional areas such as processing, storage, and switching to meet customer needs. Next generation features are routinely designed into RadiSys products as a result of advanced work with key technology partners such as Intel, Texas Instruments, and Cavium. RadiSys customers can count on a supplier that produces products that push the edge – whether it is a 40GbE ATCA platform, a new multi-core DSP board, an advanced software virtualization solution, or the highest performance ruggedized COM Express module.

The RadiSys time-to-market focus combined with the drive to implement leading edge technology empowers customers to build innovative, high-performance, network centric solutions for tomorrow’s mil/aero markets. We look forward to doing the same for you so you can BE RIGHT. NOW.

1. Technology Leadership

   

   RadiSys focuses on driving leading edge technologies into standards based product. We have close working relationships with key silicon vendors such as Intel, Texas Instruments, and Cavium Networks. Our design and development expertise and relationship with the silicon vendors allow us to rapidly bring to market COM Express and ATCA products based on the newest highest-performance silicon. This time to market focus and the addition of other new technologies such as solid-state storage and virtualization allows our customers to build solutions that meet the demanding requirements of network centric operations.

2. Engineering and Manufacturing Expertise

   

   Radisys best-in-class design and manufacturing practices provide board and system level products that will meet stringent environment and temperature requirements. In the design phase, Radisys employs the Highly Accelerated Life Test (HALT) to identify and remove design related weaknesses stemming from temperature, shock and vibration and thermal stresses– providing significant operating margins for harsh environments. Based on the HALT findings, an ongoing Highly Accelerated Stress Screen (HASS) is implemented for consistent monitoring of the ruggedized products to insure quality and reliability and quickly detect any changes in the manufacturing process – critical during field deployment and throughout the lifetime of the product. RadiSys also validates Shock and Vibration performance to ruggedized levels. This includes fatigue testing (random vibration) and resonance testing (swept sine vibration) as well as operating and non-operating shock susceptibility. Extended shock and vibration requirements, thermal solutions, conformal coat, RTV, and additional durable hardware options are also available. RadiSys delivers extreme capability and sustained reliability that can be counted on – ruggedized products for extreme environments.

3. Proven Deployments

   

   RadiSys has invested significantly to offer the industry's broadest array of COM Express and AdvancedTCA solutions and helped its customers build secured, robust and high performance applications. For more than 20 years, RadiSys has been an undisputed leader in the embedded industry because it understands the market and customer requirements second to none. We bring a rich ecosystem of partners together to address your specific needs. Whether your next application is deployed on ground, air or water or you have to design the most complex system, we will enable you. RadiSys currently have fielded deployments for ATCA and COM Express in different ruggedized environments like rough land terrains, mobile shelters and airplanes. We invite you to leverage RadiSys knowledge and its market leadership to design your next application based on open standards based COTS products.