Latest News:

Radisys Media Server Selected by Unisys to Power Next-Generation Voicemail Services

Radisys Expands Small Cell Portfolio with Qualcomm Dragonwing FSM200 Platform for FR1 and FR2

Radisys Unveils Industry-First 3GPP Release 18 5G Software for Ubiquitous Multi-RAN Connectivity

SEMPRE Partners with Radisys to Develop Resilient and Secure 5G Infrastructure

Zoom Technology Group Selects Radisys as its Technology Partner for Broadband Connectivity Expansion

Microamp and Radisys Forge Strategic Alliance Advancing the Development of Open RAN-compliant 5G mmWave Solution

Qualcomm

ABOUT Qualcomm

The company that brought cutting edge developments in 3G and 4G is now leading the world to 5G. At Qualcomm, engineers are inventing the technologies of an intelligently connected future, spearheading research efforts for the next global wireless standard, and collaborating with industry leaders to make this future a commercial reality.

Partnership Overview

Radisys has partnered with Qualcomm Technologies Inc. to deliver an integrated, pre-validated and tested solution for Qualcomm FSM9955 chipset, delivering an end-to-end RAN SoC (system on a chipset) targeted for small cells and CBRS deployments. The solution paves the way for faster 5G adoption where RAN densification and network slicing are key requirements.

“Small cell momentum is on the rise and the availability of Radisys’ open sourced 4G RAN software on the FSM platform will further accelerate adoption. We are excited about this addition to the growing small cell ecosystem and the enormous potential it holds for opening new opportunities using technologies such as 3.5 GHz CBRS.”

Irvind Ghai

Vice President, Product Management, Qualcomm Technologies, Inc
partner logo

Ready to Learn More? Contact Us.

CONTACT US